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Success Stories
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Published June
1999 Future Fab Magazine
OKI Automatically Migrates Hard IP from Different Sources For Reuse in Embedded Applications Using Rubicad's LACE How OKI benefits from Deep-Submicron Technologies by building New Silicon Systems in a Short Timeframe Takahiro Takechi, OKI Tokyo, Japan The Challenge - Choosing the Best Design
Reuse Method
Design Reuse in Various Flavors Most Common Choice-Re-Synthesize
One Company’s Choice-Successful use
of Rubicad’s LACE
With Rubicad’s LACE, OKI saves time and reduces costs in three important areas:
Another option is to reuse the existing layout of a design and migrate the layout as it is to the new process parameter. During a pure layout conversion, the topology of the layout and the relative placement of the device remain the same. Thus, a big advantage of reusing the existing layout is that the design has already been proven in silicon and will most likely work successfully again in the next process. To stay competitive, design reuse must be fast. If the time to ready a design for reuse in a new silicon system is almost the same as that of designing it new, the benefit for reuse is negated. At OKI we want a solution that offers fast turn time so we can bring our new products in advanced technologies to market rapidly. We want to reuse system design layouts wherever possible because those that worked before usually are guaranteed to work again. For that reason, we chose Rubicad's LACE, the Layout Conversion Environment, to automatically convert our existing layouts across process technologies and fabs. Requirements for the Migration of IC
Layout for Reuse in Embedded Silicon Systems
Why OKI reuses Physical Layout Wherever Possible The decision whether to create a new design or reuse an existing one for a new silicon system is driven by economical factors. Whenever the market window is critical and a product must be early to market, the trend is to reuse an existing design in a new product. The reuse of existing and silicon-proven designs protects OKI from big surprises after the chip is produced. Of course, sometimes no reusable design is available that meets performance requirements in the new technology. Then we design something new, even if it takes longer. Challenge of Reusing Existing Layout
Designs for New Silicon Systems
If the original designer made some tricky fixes like widening a specific signal to meet timing or shifting signals further apart to avoid crosstalk, they are not documented in the layout. During conversion to a new technology, these special fixes must be considered. Without documentation, this is difficult and a careful verification is required after conversion. Timing verification is important within conversion to deep-submicron technology. Therefore, in the future the conversion software must interface with a timing check tool so that if the results of timing verification do not meet requirements, the conversion tool automatically fixes them through reconversion with different parameters. Best Results through Careful Upfront
Preparation
Having the right methodology and tool suite in place maximizes the success of design reuse. OKI found the solution in Rubicad’s LACE because this method satisfies our requirements for area reduction, cost savings, and, most importantly, time savings. OKI Successfully uses LACE for Conversion
The solution to map the third-party, full custom microprocessor core for our technology is to automatically convert it with LACE. The common flow for our conversion is as follows: We compare the original technology and
the target technology by simulating design portions in both technologies
so we can make some estimates about the core performance.
Based on the results of the simulation and our specification requirements, we decide on the shrink ratio of the transistor size. The shrink ratio for the transistors is sometimes different than the overall shrink factor because of the performance difference between the original technology and target technology. We set up LACE for the specific layout style and the target technology and automatically convert the layout of the microprocessor core. After conversion to the new technology,
we check for DRC errors with our standard design rule check tool to ensure
that the converted design will pass our signoff procedures.
If the performance of the converted layout does not meet our specification, we put a different factor for the transistor sizing in the critical area of the design and let LACE run another conversion with different transistor sizing. If the modification needed to meet the performance requirements is minor, we correct the layout manually. If we have a critical design, we simulate critical parts of the converted design on the transistor level using Hspice. The automatic layout conversion of the microprocessor design for this embedded application was done in two months. Within the two-month timeframe for each process, LACE was set up for the layout style and guidelines of the microprocessor. To ensure correct technology file setup, we run external design rule and LVS checks with our standard check tool. Once LACE is set up; the conversion run for the 80,000 transistor core needs only two to four days depending on which machine we use to run the conversion. After the first run if we discover that we need to change the sizing factor for the transistors or wires, it is no problem with LACE. One or two numbers must be changed in the technology setup, and after a second conversion run, the layout matches the requirements. Before LACE when we converted our own designs or third-party designs to the next process technology, we did a linear shrink and manual design rule fixing. At that time we invested much effort to make external designs work in our process. LACE outperformed the manual method for two important reasons: Reduction in Design Time-The Most Compelling Reason to Choose a New Method OKI needs its new products to market as fast as possible. Therefore, we have to develop new chips and silicon systems rapidly. LACE allowed us to take advantage of reusing existing and silicon-proven microprocessor and DSP cores in new silicon systems within a short timeframe. Using LACE, we now can switch automatically and quickly to another process technology. OKI’s Other Specialties
LACE's Other Benefits and Design Possibilities
Library Conversion: It can be used to create libraries targeted toward specific applications by defining design parameters, such as transistor width and power bus width, according to the needs of the particular design. Libraries can be created for small, medium, and large circuits; high- or low-speed; and high- or low-voltage applications. Designers also can create personal libraries containing only the cells they need for a particular design so that those cells can be recompacted for optimum size. Block Conversion: LACE can be used to convert whole blocks of pre-routed standard cells or full custom macro blocks. In performing the layout conversion, LACE maintains the hierarchy and the same relative positions of the devices inside the layout and the same relative capacitance and resistance. It reduces power consumption in pre-routed standard cell blocks by adjusting transistor sizes as needed. Third-Party Layout Conversion: With LACE, layouts can be converted to a new fabrication technology without human knowledge or understanding of the layouts’ circuit details. This capability is important to us because we use third-party circuits that were not designed by our team. Before we had LACE, we had to convert layout designs manually, a time-consuming task. The bottom line is that LACE is a big win for our layout and design teams. |
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