Articles
Infrastructure for Design Reuse
Solve Timing and Signal Integrity Problems
An Effective Way of Design Reuse

Success Stories
Synopsys chooses RUBICAD's LADEE for layout migration of 0.13-micron memory compilers
Peregrine cuts design time and costs
IMI increases performance
OKI reuses Hard IP
Philips migrates microprocessor core
Qualcomm optimizes Standard Cell Libraries
Xilinx migrates FPGA

San Jose, CA, January 18, 1999…Rubicad Corporation, a leading EDA supplier of layout and migration tools for physical circuit designs, today announced that the company is introducing LADEE, a new integrated environment for layout design in deep-submicron technologies.

LADEE stands for Layout and Design Environment and is the first integrated, full-custom layout design tool suite that allows to create full custom layout with design reuse across foundries, applications and fabs in mind. LADEE is addressing signal integrity problems like crosstalk and optimizing for performance and power. It includes modules for layout entry (LACEedit), for extraction and verification, for compaction , and hierarchical conversion (LACE).

LADEE supports timing-driven layout design

A state-of-the-art design technology for deep-submicron technology has to consider the advanced requirements for at 0.25, 0.18 micron and below. During the design process the designer needs to take into consideration signal integrity and circuit timing issues.
The layout design environment, LADEE, includes analysis approach for crosstalk and considers the results of the crosstalk analysis during the design process. Similar has to be done for circuit timing to achieve the requirements for circuit speed and power consumption. For that LADEE gives active control over the interconnect capacitance's created during the physical design process.
LADEE also recognizes more sophisticated design rules, which are highly conditional for specific layout structures in 0.25-micron technologies and below, and solves those situations.

"With LADEE we are targeting the general IC layout market", remarked Michael Reinhardt, president of Rubicad. "Our experience with 0.18 micron technology has shown that tight wire capacitance control is needed to increase the performance. LADEE's tool suite offers timing-driven layout design and reduces net-specific cross-coupling capacitance to avoid signal integrity problems like cross-talk, optimizes power consumption and improves performance with specific transistor and power sizing and wire spacing capabilities"

LADEE enables optimization of Hard IP across applications and process technologies

If post-layout verification and simulation results show timing and electrical problems, it is necessary to modify the layout only around the problem area without rearranging the overall topology of the physical design. Both automatically placed and routed designs and handcrafted designs need to be optimized for speed and power consumption. LADEE solves these timing and signal integrity problems automatically.

LADEE for SOS design

LADEE provides an infrastructure for design reuse and supports a reuse design methodology that enables designers to create high performance silicon systems from existing proven designs in a timely manner.

Pricing and availability:

LADEE runs on SUN, HP and Pentium workstations under UNIX and LINUX. Shipments begin now. Several licensing options are available, beginning at $69.000 (USD)

About Rubicad:

Rubicad Corporation is a pioneer in developing automatic layout migration software. The Company  addresses the physical design tool market, and offers layout migration tools and services. Customers include major international IC manufacturers, semiconductor and fabless companies and system manufacturers.

For information contact Rubicad Corp., 1150 North First St., Suite 130, San Jose, CA 95112,
408-995-3334, Fax: 408-995-3335, www.rubicad.net, info@rubicad.com

###

LACE and LADEE are registered trademarks, LACEedit,  is trademark of Rubicad Corporation.
All other trademarks are the properties of their respective owners.

Back to Top