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Sucess Stories
Synopsys chooses RUBICAD's LADEE for layout migration of 0.13-micron memory compilers
Peregrine cuts design time and costs
IMI increases performance
OKI reuses Hard IP
Philips migrates microprocessor core
Qualcomm optimizes Standard Cell Libraries
Xilinx migrates FPGA

Power Optimization in UDSM designs by RUBICAD's TopQuality Migration Service

For an increasing number of wireless applications, higher frequencies, lower supply voltage levels, and power optimization are becoming necessities in IC design. RUBICAD’s TopQuality Service team utilizes the LADEE Tool Suite which is designed to solve different kinds of power problems on the physical layout level.

General reduction of power consumption
Wireless applications demand the lowest possible power consumption. This can be achieved by combining a power analysis tool together with the LADEE Tool Suite. The results of the analysis tools will be automatically implemented into the physical design by the LADEE Tool Suite. Such layout changes include transistor sizes and wire changes for reducing parasitic capacitance in the wiring. This method is particular useful for high-speed full custom designs such as datapath and DSP. The method can also be applied inside an ASIC design flow using synthesis and place & route technology.

Voltage drop
Voltage drop is a temporary effect that occurs when a chip operates at peak performance. The number of gate switches in an area of the chip can be so high that some supply lines show temporary voltage drops, which can cause functional errors. Voltage drops can be prevented by either improving the power supply to this particular chip area or by reducing the power consumption in this area. The first solution requires the implementation of larger power supply lines. The second solution can be implemented by reducing the capacitance of the wiring of the local nets in that area. Both solutions can be easy implemented using the LADEE Tool Suite in combination with CrossSpeed and external analysis tools.

Hot Spots
Hot spots are the consequence of high power consumption in a local area. The primary effect can be overheating of the device; the long-term effect is fatal errors caused by metal migration. To prevent hot spots, designers can widen power metal lines to reduce the local current density or they can reduce the power consumption in that particular area. Both approaches can be combined with the LADEE Tool Suite.

All of the above problems can be solved in a single process using the LADEE Tool Suite, applied either to new designs made from scratch or in combination with migrating a design to a different process technology.

RUBICAD's design and layout migration specialists work with your team to deliver best-in-class solutions. You reduce your development risk while increasing your ability to deliver designs on time. 
Call (408) 995 3334 or send an email to service@rubicad.com and discuss your next design challenge with us.

Check out the success stories on this site and learn how other companies have leveraged their designs.

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