| Hard
IP Migration
Cores and Macros Memory and Compilers Library Migration Design Optimization
Sucess Stories
|
Speed
Improvement on the Physical IC Design Level by RUBICAD's TopQuality Design
Service
During the
last 20 years, shifting an IC design to a more advanced CMOS technology
always resulted in faster circuits. But today, shifting a design to an
ultra deep sub-micron (UDSM) technology with 0.18-micron gate lengths does
not guarantee a faster design. This is because accurate timing simulation
can only be done after the physical mask layout is available for the UDSM
technology. But what if the physical mask layout does not meet the specification
and the chip cannot compete in the market? Since the layout is the foundation
of wafer production, all the other steps in a complete design flow are
worth nothing if the outcome is a physical mask layout that is not ready
for successful wafer production.
What is
Influencing the Signal Delay Time
All other EDA tools work on a netlist level for modifying the W/L in order to reduce transistor resistance to make the signal faster. But increasing the transistor's W/L will also increase the capacitance of the input transistor, which in turn increases power consumption. Rubicad's LADEE Tool Suite, which includes the CrossSpeed module, is the only set of tools that can influence the resistance and capacitance of the wires and optimize critical wires directly in the layout. Call (408) 995 3334 or send an email to service@rubicad.com and discuss your next design challenge with us. Check out the success stories on this site and learn how other companies have leveraged their designs. |
| Copyright © 1996-2001, Rubicad Corp. All rights reserved. |
|