AutoMask
The Automatic Layer Manipulation Tool
AutoMask is a tool for automatically creating
and modifying an IC mask layout to prepare it for autoamtic compaction,
conversion, extraction and verification tasks. It provides an extensive
set of predefined macros for the push-button setup of standard and frequently-used
functions.
Automask combines net information and
mask manipulation for net-related extraction tasks.
Features for Deep-Submicron Technology
Modifying Tab Density
AutoMask automatically takes careof modifying
tab density in deep-submicron (DSM) and ultra deep sub-micron (UDSM) technologies,
and automatically inserts additional tabs to meet the new technology's
requirements.
Device Extraction
AutoMask automatically extracts unlimited
number and types of devices for special sizing during a compaction flow.
Aditional Layers and Phase Shift Masks
DSM and UDSM technologies require additional
mask layers that were rarely seen in previous technologies. AutoMask
automatically inserts such additional layers when needed, for example,
a phase shift mask. These masks are automatically adjusted during the compaction
and conversion process using the LACE tool. AutoMask handles an unlimited
number of layers.
Correct Slopes
Some layouts contain edges with angles
other than a multiple of 45 degrees (i.e., a non 45-degree edge). These
edges have been created by other tools and processing steps. Most design
tools and technologies do not accept non 45-degree structures. Automask
automatically converts non 45-degree edges to 45-degree edges.
Deep-submicron Rules
Deep-submicron technologies require layout
structures that did not exist in previous technologies. for example, a
hammer-shaped endgap. Automask automatically analyses the layout and inserts
additonal structures as needed to satisfy these deep-submicron rules.
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